MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS

» Número: US2020005983A1 (A1)

» Fecha Publicación: 02/01/2020

» Solicitante: INTEL CORP?[US]

» Inventor: SANKARASUBRAMANIAN MALAVARAYAN?[US]; MIN YONGKI?[US] (4)

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Embodiments herein relate to a magnetic encapsulant composite, comprising a mixture of a first material that is a soft magnetic filler, a second material that is a polymer matrix, and a third material that is a process ingredient. The magnetic encapsulant composite may then encapsulate or partially encapsulate a magnetic inductor coupled to a substrate to increase the inductance of the magnetic inductor and/or to strengthen the substrate to which the magnetic inductor and the composite are coupled.

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